MediaTek unveils ambitious plans with Dimensity 9400 chip

MediaTek’s ambitious plans with the Dimensity 9400 chip

At a groundbreaking ceremony held on January 30, MediaTek marked the start of construction of its new Hsinchu HSR office building, scheduled for completion by 2027. The development is being hailed as a milestone important for the tech giant. During the ceremony, MediaTek Chairman Ming-suke Tsai and CEO Li-Hsing Tsai took the stage, unveiling the company’s latest advancements in product and technology innovation.

Li-Hsing Tsai expressed MediaTek’s unwavering confidence in the current wave of AI integration in mobile phones. He highlighted the success of their flagship chip, the Dimensity 9300, which received considerable reception. Anticipating further progress, Tsai announced MediaTek’s plan to launch the Dimensity 9400 in the fourth quarter of the current year.

What sets the Dimensity 9400 chip apart is its adoption of TSMC’s cutting-edge 3nm process, a revolutionary advancement for MediaTek. This represents a significant leap in performance and energy efficiency compared to its predecessor. The chip is expected to feature enhanced capabilities with its upgraded Cortex-X5 core, a step up from the Cortex-X4 featured in the Dimensity 9300. The use of LPDDR5T memory ensures seamless integration with local AI computing requirements.

The advanced AI performance of the Dimensity 9400 chip opens the door to running larger AI models directly on the device, surpassing the Dimensity 9300’s impressive 33 billion parameter large language model. promises enhanced capabilities and a more seamless user experience.

Working closely with TSMC, MediaTek positions itself as a key player in the development of 3nm chips. TSMC’s 3nm process is one of the most advanced semiconductor technologies in the world. It offers an 18% performance improvement with the same power level or a remarkable 32% reduction in power consumption with the same frequency performance. Additionally, the process enables a remarkable 60% increase in logic density compared to the previous 5nm process.

MediaTek’s long-standing partnership with TSMC has paid off, with the announcement in early 2024 confirming their joint efforts to develop 3nm chips. Mass production is expected to begin later this year, solidifying MediaTek’s position as a driving force in the evolution of semiconductor technology.

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